40 Layer PCB fabrication multilayer electronic PCB boards reverse engineering PCB factory

40 Layer PCB fabrication multilayer electronic PCB boards reverse engineering PCB factory

per Bag

Specification:

MOQ1 PIECE Quick Proofing

Product Details

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Company Information

Company introduction

King Field has the capability to manufacture pcb ranging from basic single sided boards up to forty layers, and provide one stop turnkey services, including pcb manufacture, assembly, components sourcing and function testing.With one-stop solution, high-end product structure, professional product development and manufacturing technology, stable quality performance and well management system,

King Field has established long-term and stable cooperate relations with the world's leading communication equipment , aerospace electronics and medical equipment manufacturers.

Products Description

RPCB　Main Equipment

Rigid RPCB Manufacturing Capability

Rigid RPCB Manufacturing Capability
Item	RPCB	HDI
minimum linewidth/linespacing	3MIL/3MIL(0.075mm)	2MIL/2MIL(0.05MM)
minimum hole diameter	6MIL(0.15MM)	6MIL(0.15MM)
minimum solder resist opening (single-side)	1.5MIL(0.0375MM)	1.2MIL(0.03MM)
minimum solder resist bridge	3MIL(0.075MM)	2.2MIL(0.055MM)
maximum aspect Ratio (thickness/hole diameter)	10：1	8:1
impedance control accuracy	+/-8%	+/-8%
finished thickness	0.3-3.2MM	0.2-3.2MM
maximum board size	630MM*620MM	620MM*544MM
maximum finished copper thickness	6OZ(210UM)	2OZ(70UM)
minimum board thickness	6MIL(0.15MM)	3MIL（0.076MM）
maximum layer	14层	12层
Surface treatment	HASL-LF、OSP 、Immersion Gold、 Immersion Tin 、Immersion Ag	Immersion Gold、OSP、selectiveimmersion gold、 carbon print
Min/max laser hole size	/	3MIL / 9.8MIL
laser hole size tolerance	/	10%

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