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4 Layers PCB ENIG Black Solder Color IPC-3 Standard Circuit Board enepig PCB fabrication factory
4 Layers PCB ENIG Black Solder Color IPC-3 Standard Circuit Board enepig PCB fabrication factory
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Product Details
Video Description
Company Information
Company introduction
King Field has the capability to manufacture pcb ranging from basic single sided boards up to forty layers, and provide one stop turnkey services, including pcb manufacture, assembly, components sourcing and function testing.With one-stop solution, high-end product structure, professional product development and manufacturing technology, stable quality performance and well management system,
King Field has established long-term and stable cooperate relations with the world's leading communication equipment , aerospace electronics and medical equipment manufacturers.
Products Description
RPCB Main Equipment
Rigid RPCB Manufacturing Capability
Rigid RPCB Manufacturing Capability | ||||
Item | RPCB | HDI | ||
minimum linewidth/linespacing | 3MIL/3MIL(0.075mm) | 2MIL/2MIL(0.05MM) | ||
minimum hole diameter | 6MIL(0.15MM) | 6MIL(0.15MM) | ||
minimum solder resist opening (single-side) | 1.5MIL(0.0375MM) | 1.2MIL(0.03MM) | ||
minimum solder resist bridge | 3MIL(0.075MM) | 2.2MIL(0.055MM) | ||
maximum aspect Ratio (thickness/hole diameter) | 10：1 | 8:1 | ||
impedance control accuracy | +/-8% | +/-8% | ||
finished thickness | 0.3-3.2MM | 0.2-3.2MM | ||
maximum board size | 630MM*620MM | 620MM*544MM | ||
maximum finished copper thickness | 6OZ(210UM) | 2OZ(70UM) | ||
minimum board thickness | 6MIL(0.15MM) | 3MIL（0.076MM） | ||
maximum layer | 14层 | 12层 | ||
Surface treatment | HASL-LF、OSP 、Immersion Gold、 Immersion Tin 、Immersion Ag | Immersion Gold、OSP、selectiveimmersion gold、 carbon print | ||
Min/max laser hole size | / | 3MIL / 9.8MIL | ||
laser hole size tolerance | / | 10% | ||
Certifications
Product packaging
services we provide
